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Ultra High Density 2D Fiber Array Unit 16 Channels To 1024 Channels

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Ultra High Density 2D Fiber Array Unit 16 Channels To 1024 Channels

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Place of Origin : China

Brand Name : Gracyfiber

Certification : ISO CE RoSH

MOQ : 100pcs

Fiber pitch : 250 µm standard

Operating temperature : -40°C to 85°C

Connector type : FC, SC, LC, MPO (customizable)

Operating wavelength : 1260 nm to 1625 nm

Return loss : > 55 dB

Insertion loss : < 0.3 dB

Payment Terms : T/T

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Ultra-High Density 2D Fiber Array - 16 To 1024 Channels

1. Product Overview

GRACYFIBER's 2D Fiber Array (FA) is a high-precision optical interface component designed to break through I/O bottlenecks in AI computing infrastructure and high-performance computing (HPC). By employing an innovative 2D matrix architecture instead of traditional linear arrangement, this array achieves revolutionary ultra-high fiber density in an extremely compact physical space. Our 2D FA is built on precision glass or ceramic substrates and offers scalability up to 1024 channels. It features micron-level alignment accuracy, extremely low insertion loss, and superior long-term mechanical reliability, making it an indispensable core component driving next-generation 800G/1.6T+ optical engines, silicon photonics packaging, and co-packaged optics (CPO) systems.

2. Product Features
Parameter Unit 16 32 64 128 256 512 1024
Wavelength nm 1260–1650
Materials - Glass / Ceramic
Geometry 2D Matrix
CorePitch - 127um
Core Pitch Tolerance μm ±1
Insertion Loss dB ≤0.8ypical 0.5)
Return Loss dB UPC≥40, APC≥50
Fiber Type - OM1/OM2/OM3/OM4/OM5/G67A1/ A2/ B3 or Customized
Fiber Coating um 250 µm / 350 µm
Fiber Type Length cm 100+/-10 or customized
Connector - .FC/LC/SC/E2000/MT/MPO/MMC
Operation Temperature °C -5~65
Storage Temperature °C -40~85

(Developed specifically to address your CPO space constraints and high-concurrency light-emitting interconnect pain points)

Features: Matrix architecture and ultra-high channel density (16 to 1024 channels)

Benefit: Completely breaks through the physical width limits of traditional one-dimensional arrays, supporting ultra-large-scale integration of up to 1024 channels. This allows architects to achieve near-package routing of massive optical I/O ports within extremely limited space around the switching ASIC chip, perfectly meeting the extreme size requirements of CPO and NPO.

Features: Micron-level alignment control and superior channel-to-channel uniformity

Pain points addressed/value: Even in a matrix of hundreds of channels, the fiber pitch (127 μm) tolerance is strictly controlled to an extremely high level of ±1 μm. This greatly reduces the complexity of automated active alignment of ultra-high-channel parallel optical modules and significantly improves packaging yield.

Features: Extremely low optical crosstalk and ultra-low insertion loss (≤ 0.8 dB, typical 0.5 dB)

Benefit: Combined with high return loss (UPC ≥ 40 dB, APC ≥ 50 dB), it effectively isolates signal interference between adjacent channels and saves optical power budget when processing massive concurrent data streams. This is crucial for the data integrity of high-bandwidth AI computing clusters.

Features: Precision substrate material (glass / ceramic)

Benefit: Utilizing glass or ceramic materials with excellent thermal stability ensures that the array will not experience coupling shift due to thermal expansion under full load operation from -5°C to 65°C. This provides superior long-term reliability for high-power AI servers and HPC systems.

Features: Comprehensive fiber compatibility (supports SM, MM, PM)

Benefit: Fully compatible with OM1-OM5 multimode fiber, G657 series single-mode fiber, and custom polarization-maintaining (PM) fiber across the 1260–1650 nm operating wavelength range. This provides system designers with ultimate flexibility, enabling seamless integration regardless of the network topology of your AI cluster.

3. Applications
  1. AI/GPU Optical Interconnects: Providing bottleneck-free optical I/O for supercomputing clusters processing trillion-parameter AI models.
  2. Co-Packaged Optics (CPO): Achieving ultra-high-density, 3D-space optoelectronic integration between switching chips and optical engines.
  3. 800G/1.6T and higher speed optical modules: Serving as core multi-channel optical interfaces for parallel optical transmission systems.
  4. Silicon Photonics Packaging: Two-dimensional grating coupler arrays to match advanced photonic chips.
  5. High-Performance Computing (HPC): Meeting the interconnect requirements of supercomputers for extremely low latency and extremely high throughput.
  6. Optical Engines: Ultra-compact miniaturized multi-channel optical transceiver components.

Product Tags:

High Density 2D Fiber Array

      

2D Matrix Fiber Array Unit

      

2D Fiber Array Unit

      
Wholesale Ultra High Density 2D Fiber Array Unit 16 Channels To 1024 Channels from china suppliers

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